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Ohashi HBM-10 ACF Tabletop FPC Heat Bonder 155676289556 Manufacturer Agilent Part Number E5406-60001

4.4
USD1148.17 USD1189.17

Pay in 4 interest-free payments of $287.04 Learn more

SKU: 68937545869

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Ships within 48 hours · Estimated delivery Sep 30 - Oct 5

Description

Ohashi HBM 10 ACF Tabletop FPC Heat Bonder 155676289556 Manufacturer Agilent Part Number E5406 60001 Manufacturer Agilent Part Number E5406 60001 Model Number E5406A SKU 19 13156 Ref 23 97375 Manufacturer Xilinx Part Number 1281021 Model Number HW FMC XM500 SKU 19 68652 Ref 23 97948

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